| 摘要 |
PURPOSE:To shorten an inspection time by using an objective lens of high power to detect a pattern and further using a lens of high power to detect the shape of a pattern. CONSTITUTION:A wafer is placed on a specific XY table and then the objective lens 8 of low power is selected. Image light of the pattern of the wafer surface passed through the objective lens 8 is branched by a half-mirrors 13 and 14, etc., into three optical paths and light components separated by color filters 16, 17, and 18 are converted into electrical signals, and then a computing element 22 calculates the hue. Further, the objective lens 19 of high power is selected when necessary. Light of a pattern image from the objective lens 9 is guided to a photoelectric detector 25 through a half-mirror 11 to form an image. Brightness data on one chip is stored in a storage circuit 26 and compared with electric signal obtained as to a next chip by a comparing decision device 25 to know a shape defect of the pattern. |
