| 摘要 |
PURPOSE:To enable to surely perform a marking on defective elements by a method wherein the titled probing machine is constituted in such a way that the marking is performed on the defective elements at a position separated from normal elements after the measurement of all elements, wafers, was completed. CONSTITUTION:Numerous wafers, which have been accommodated in a cassette 4 before being measured, are conducted to a conveying belt 5 one by one, are conveyed along an arrow in the diagram and are fed in a pre-alignment unit 6. The wafers 1, which have come being fed towards an arbitrary direction from the cassette 4, are positioned in a condition aligned in a constant direction as indicated by a one dotted chain line in the diagram in the pre-alignment unit 6. When the measurement of all of the elements, wafers, was completed, the wafers are shifted to a position E, where a marking unit 12 is standing by, in a condition fixed attractingly by a suction table 9, in brief, in the same condition as the positions and directions at a time when the wafers were measured without changing the positions and directions at a time when the wafers were measured. When a defective element, which has been memorized in advance by the instruction sent from the control part, comes right under the marking pen, the defective element is made to stop at a position located right under the marking pen. Then, the suction table 9 is made to ascend or the marking unit 12 is made to descend and a mark is put on the surface of the defective element. |
