发明名称 EPOXY RESIN COMPOSITION
摘要 PURPOSE:To obtain a pressure-moldable epoxy resin composition good in transparency and impact resistance and excellent in molding properties, by mixing a specified mixed epoxy resin with an acid anhydride curing agent and a dibenzylidenesorbitol. CONSTITUTION:An epoxy resin composition comprising a mixed epoxy resin (a) comprising 50-80pts.wt. bisphenol A epoxy resin of a m.p. of 60-170 deg.C and 20-50pts.wt. triglycidyl isocyanurate or its derivative, 30-150pts.wt. acid anhydride curing agent (b) and 0.1-5.0pts.wt. dibenzylidenesorbitol (c). As said bisphenol A epoxyresin, one which is solid at room temperature and has a m.p. of, usually, 60-170 deg.C is used. In order to enhance the rate of production in molding, said resin composition is partially reacted to B stage by suitable heat aging during the production of the composition.
申请公布号 JPS61215616(A) 申请公布日期 1986.09.25
申请号 JP19850056011 申请日期 1985.03.22
申请人 TOSHIBA CORP 发明人 YOSHIZUMI AKIRA;MATSUMOTO KAZUTAKA;UCHIDA TAKESHI
分类号 C08G59/00;C08G59/24;C08G59/26;C08G59/32;C08G59/42;C08L63/00 主分类号 C08G59/00
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