发明名称 WIRE BONDING DEVICE
摘要 PURPOSE:To remove any noxious gas produced and to improve the safety by a method wherein, within a bonding device wherein a ball is formed at the end of wire by discharging in the space between a discharging torch and the end of wire for pressure fixing connection, a suction nozzle is provided near the end of a capillary. CONSTITUTION:A wire 17 let out of a clamper 11 is passed through a capillary 15 to project an end 17a of the wire 17 while a discharging torch 19 is positioned opposing to the end 17a. Besides, the clamper 11 and the torch 19 are connected to a power supply 23 while a ball 17b is formed at the end 17a by discharging in the space between the torch 19 and the wire end 17a to be pressed on a lead frame not shown in figure for bonding operation. In such a constitution, the hollow and letter L type torch 19 exposes a suction nozzle 18 passing through the torch 19 to the end to be connected to a filter 21 and a vacuum pump 22 through the intermediary of a suction tube 20. Through these procedures, any noxious gas produced during the bonding operation may be sucked in the nozzle 18 to prevent the gas from diffusing in the air, thus improving the safety.
申请公布号 JPS61214529(A) 申请公布日期 1986.09.24
申请号 JP19850054498 申请日期 1985.03.20
申请人 HITACHI LTD 发明人 OKAMOTO MICHIO
分类号 H01L21/603;H01L21/60 主分类号 H01L21/603
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