| 摘要 |
PURPOSE:To prevent overflow of solder and enhance bonding strength by providing an adhesive part of extra solder to the connecting and coupling region of an outer lead frame. CONSTITUTION:An outer lead frame 12 of tape carrier 11 has an elongated hole (width W) 15 at the coupling part with a conductor pattern 14 of a substrate 13. The solder 16 melts by local heating through the lead frame 12 coupling the conductor pattern 14 and the bottom surface 12a of lead frame, and extra solder flows into the hole 15, coupling with the hole wall 17 and filling the hole 15. The preferable width W of hole 15 is about 1/4-1/3 of the total width of the lead frame 12, considering material of solder 16 and pressurized heating condition. According to this structure, overflow of extra solder can be prevented and coupling strength can be enhanced and thereby reliability of junction of multi-pin and high density tape carrier can be improved. |
