| 摘要 |
<p>A carrier element for IC modules, whereby several leads are arranged on a carrier film, which leads are each connected at one end with a terminal of the module and run into a contact surface at the other end. Whereas the contact surfaces are arranged on the side of the film not touching the module within the periphery of the module, the outer leads are connected with the corresponding terminals of the module through punched out windows in the film. The carrier element thus has a very compact form, the area of which is adapted to the size of the IC module.</p> |
