HEAT SINK FOR ELECTRONIC COMPONENTS

摘要

PH. 25.110 A heat sink assembly especially adapted for use with semiconductors having flat packages such as of the TO-220 type wherein a heat sink mounting surface is bounded by two upstanding walls having outer edge flanges inturned over the mounting surface to cooperate with a spring clip to press a mounted component against the heat sink surface. Mounting bolts and/or holes in the mounting surface are dispensed with and the assembly is low cost and simple to use.