| 摘要 |
PURPOSE:To obtain a burn-in board constituted so as to be capable of efficiently arranging socket for IC, by arranging a composite circuit formed in a flat form on a substrate and arranging the socket for IC thereon. CONSTITUTION:Sockets 2 for IC are arranged on a substrate 1 having desired printed wiring applied thereto and composite circuits 3 are held between the sockets 2 for IC and the substrate 1 to solder required parts. Each composite circuit 3 is formed into a flat plate shaped resistor pack made of ceramic and a desired number of resistors having a desired standard are received therein. For example, two sockets 2 for IC are attached to one composite circuit 3 but, if the composite circuit 3 is further made large, the number of working processes from the manufacturing aspect of a burn-in board are also reduced. By this method, the sockets 2 are efficiently arranged and, therefore, ICs increased by about 30% as compared with conventional ones can be arranged.
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