| 摘要 |
PURPOSE:To offer an insulation board for a printed circuit which has held mechanical strength sufficiently at low cost, by a method wherein heating, pressurizing and molding are performed by placing a molding material between prepreg so that the molding material is positioned at the central layer by making use of the prepreg obtained by impregnating a sheetlike base material with resin and drying the same and a particulate or powdery molding material composed of a filler and the resin through mixing and kneading them. CONSTITUTION:A sheetlike base material means paper or glass cloth or cotton cloth or polyester cloth, which is made into prepreg by impregnating the same with thermosetting resin such as phenolic resin or melamine resin or polyester resin or epoxy resin or silicone resin and drying the same. A particulate or powdery molding material is obtained by mixing and kneading an inorganic filler such as a glass fiber or glass powder or clay, an organic filler such as pulp or woodmeal and the above thermosetting resin. The molding material obtained in this manner is placed between the prepreg, heated, pressurized and molded within a mold and an insulation board for a printed circuit is obtained. |
