| 摘要 |
PURPOSE:To reduce the plane area for mounting a semiconductor element by a method wherein semiconductors mounted in the film carrier process are laminated to use at least the leads of common electrodes of the laminated semiconductors in common. CONSTITUTION:Metallic bumps 23 formed on electrodes 22 of a semiconductor element 21 are bonded to leads 24 formed on a film 25 made of long polyimide, epoxy, polyester etc. by etching Cu foil while the leads 24 are further bonded to metallic bumps 13 formed on electrodes 12 of another semiconductor element 11 in the extending direction to constitute a structure using the leads 24 in common. When such a structure is mounted on a circuit substrate, the bonded positions for connecting to the circuit substrate may be reduced remarkably since the plane area may be halved simultaneously using at least the leads of common electrodes in common. |
