| 摘要 |
PURPOSE:To make a thickness thin and lower a cost and improve reliability by integrally forming a conductor lead extending from an electrode of a semiconductor device disposed in an area separated in a plane from electrode groups with the electrode groups, and exposing the electrode groups from a surface of a card body. CONSTITUTION:A lead 11 connected to an electrode 10 of a semiconductor device 2 is integrally formed with an electrode terminal 12 for performing a delivery of a signal with an external electrode terminal and by the same material. An area for forming an electrode terminal 12 is separately formed from an area for disposing a semiconductor device 2. An electrode terminal 12 is buried and incorporated in a card body 6 so as to expose its surface from the surface of the card body 6. Thereby, an entire thickness becomes a total of the thickness of the semiconductor device 2 and the lead 11, so that the card is made thin. Even when a bending stress or a pressure by an external electrode terminal of the electrode terminal operate on the card body, the semiconductor or the electrode terminal is not broken but can be produced at low cost.
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