| 摘要 |
PURPOSE:To achieve bonding force of high degree and heat resistant connection without effecting press cure by a method wherein adhesive of specified composition is coated on the reinforcing plate and the adhesive is changed into B stage while the reinforcing plate is stacked on the base so as to bring the bonding layer of the reinforcing plate into contact with the back surface of the base to bond them under low temperature and low pressure and, thereafter, the bonding layer is processed by heating. CONSTITUTION:The adhesive of a mixture, containing 100pts.wt. of resol type phenol resin, 5-100pts.wt. of novolac type epoxy resin and 5-60pts.wt. of acrylonitrile- butadiene copolymer, is coated on the surface of the reinforcing plate in first stage to form the bonding layer, then, the adhesive is changed into B stage by heating and drying said reinforcing plate in second stage, the bonding layer of the reinforcing plate, thus formed, is stacked on the flexible print base so as to be brought into contact with the rear surface of the base to bond them under a low temperature and a low pressure in third stage and the adhesive is cured by heating it under the temperature of about 100 deg.C in fourth stage whereby both of them are bonded strongly. In case the content of novolac type epoxy resin is less than 5pts.wt., resistance to heat and bonding strength are reduced while the flexibility of the adhesive is reduced remarkably in case the content of the same resin exceeds 100pts.wt.
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