| 摘要 |
PURPOSE:To uniformize the cross-sectional shape of the fine hole in the longitudinal direction by forming a plating layer so as to cover the fine filament portion from above the conductive film which is exposed from a trench-shaped resist pattern, and removing the trench-shaped resist pattern. CONSTITUTION:By selectively exposing and developing the positive-type resist film 33 which is applied on the conductive film 32 formed on the surface of a substrate 31, a trench-shaped resist pattern film 34 is formed which contains a fine filament portion 34a in which the film thickness of the layer 33 is thin, and thereafter a metal layer 35 is plated and formed by means of the plating method so as to cover the filament portion 34a from above the conductive film 32 which is exposed from the film 34. Then, the film 34 including the filament portion 34a is removed, thereby obtaining an ultra-fine pipe 37 having a fine hole 36 formed in the portion from which the filament portion 34a was removed. This allows the cross-sectional shape of the fine hole 36 to be uniform in the longitudinal direction, and also allows various hole shapes. |
