| 摘要 |
PURPOSE:To perform bonding readily without using barrier metal, by forming metal projections at the bottom surface of a recess part, which conforms to the outer size of a semiconductor element that is formed on a substrate, and arranging the semiconductor element. CONSTITUTION:A recess part 12 for positioning a semiconductor element 1 having the size, which conforms to the outer size of the semiconductor element 1, is provided in a substrate 10. Metal projections 14 are formed at positions corresponding to electrode 2 of the element 1 at the bottom surface of the recess part 12. The element 1 is evacuated and sucked by a jig 15. The element is arranged in the recess part 12. The electrodes 2 and the metal projections 14 are automatically positioned by the recess part 12. Then the element is compressed and heated by the jig 15. When, e.g., the electrodes 2 are made of Al and the metal projections are made of Au, they are readily bonded by Au.Al alloy. When the jig 15 is lifted, the metal projections are separated from the substrate. Thus, the positioning and bonding of the electrodes of the semiconductor element and the metal projections of the substrate can be simply carried out. |
