发明名称 ADHERING METHOD FOR MASKING TAPE
摘要 PURPOSE:To execute adhesion of masking tapes precisely and to permit the easy removal of non-masking tapes in the stage of a metallic substrate for a lead frame to striped plating by using a rugged roll made into specific construction having a suction effect as an adhering roll. CONSTITUTION:The substrate 1 for the lead frame made of copper and copper alloy is subjected to a pretreatment 2 and thereafter the masking tapes 3 which are parted to three masking tapes 3' and two non-masking tapes 3'' by a cutter 6 are adhered to the surface of the substrate 1. The adhering roll 8 is provided with projecting parts 8' for adhering the tapes 3' and recesses 8'' for the tapes 3''. The projecting parts and recesses are communicated with a central intake port 9 through small holes 10, 11. The tapes 3' are pressed and adhered onto the substrate 1 by the projecting parts 8' and the tapes 8'' are taken up on a drum 13 via guide rolls 5. the substrate is plated to a stripe shape by a plating device 14. A base plate 16 of which the opposite side is prevented by another tape 3 from being plated is taken out.
申请公布号 JPS61210197(A) 申请公布日期 1986.09.18
申请号 JP19850049556 申请日期 1985.03.13
申请人 HITACHI CABLE LTD 发明人 KAYANE KOICHI;HAGITANI SHIGEO
分类号 C25D5/02 主分类号 C25D5/02
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