| 摘要 |
An electronic circuit assembly comprises one or more integrated circuit dice 30 with contact pads 34, which are connected to corresponding pads 24 on a silicon substrate 20. The substrate 20 itself has active semiconductor devices 50 integrated within it and electrically connected with the contact pads 24. The substrate 20 has a larger surface than the dice 30 and external electrical connection of the assembly is made via conductive elements 23 on that part of the substrate projecting beyond the dice. The pattern of integration in the integrated circuit dice may be a mirror image of the pattern of integration in the substrate. Alternatively, the devices 50 in the substrate 20 may be connected to form a voter circuit that selects between different ones of the dice 30. The substrate may be used to interconnect two dice mounted on opposite sides of the substrate, face-to-face, with their aligned contact pads interconnected by plated-through holes in the substrate. <IMAGE> |
