发明名称 |
A pressure sensitive adhesive and a pressure sensitive adhesive film having thereon a layer of the same. |
摘要 |
<p>A pressure sensitive adhesive film reducible in adhesive force by UV-light comprises a base film permeable to UV-light and a layer of a pressure sensitive adhesive on one side of the base film. The adhesive comprises one elastic polymer selected from apolymer composed of acrylic acid ester copolymersor a saturated copolyester composed of dibasic carboxylic acids and dihydroxy alcohols; 15-200 parts by weight per 100 parts by weight of the elastic polymer of an UV-light polymerizable acrylic acid ester having not less than two acryloyl or methacryloyl groups in the molecule and a molecular weight of not more than 1000; A photopolymerization initiator for inducing the photopolymerization of the UV-light polymerizable acrylic acid ester; The film is suitable as a dicing film in dicing a semiconductor wafer to dices in which the wafer is fixed on the film with a relatively large adhesive force and by UV-light radiation from the other side the adhesive force of the film is reduced that the dice loosely adheres onto the film.</p> |
申请公布号 |
EP0194706(A1) |
申请公布日期 |
1986.09.17 |
申请号 |
EP19860200196 |
申请日期 |
1986.02.11 |
申请人 |
BANDO CHEMICAL INDUSTRIES, LTD. |
发明人 |
KURODA, HIDEO;TANIGUCHI, MASAO |
分类号 |
C09J4/06;C09J7/02;H01L21/302;H01L21/68;H01L21/78;(IPC1-7):C09J3/14;C08F265/00 |
主分类号 |
C09J4/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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