| 摘要 |
PURPOSE:To bond uniformly and preferably by providing a plurality of fine through holes passing both flat surface of a supporting substrate at the substrate. CONSTITUTION:Fine holes 5 of 1mm in diameter passing both surfaces of a supporting substrate 4 with holes made of quartz glass of 0.5mm thick are formed, for example, at intervals of 5mm in lateral and longitudinal directions. The substrate 4 is, for example, bonded to a wafer 3 of GaAs (100) crystal of 0.15mum thick with resist as an adhesive 2. Excess adhesive is flowed to the holes 5, and the adhesive 2 between the wafer 3 and the substrate 4 is thinly and uniformly extended. |
