| 摘要 |
PURPOSE:To facilitate the work of fabricating a semiconductor device and to enable the stable connection of a finger, by forming a groove in the central part of the finger along the longitudinal direction of the finger so as to give moderate flexibility and stiffness to the finger. CONSTITUTION:A bump 4f to be connected to an electrode of a semiconductor chip 1 is formed in the end portion 4e of a finger. On the lower side of a part joining this end portion 4e to the middle part, an indented portion 4g is formed in the direction perpendicular substantially to a groove 4a, and a part beyond the indented portion 4g constitutes the bump 4f being protuberant from the upper surface of the finger 4. By this construction, the stiffness of the finger 4 can be increased further. Thereby moderate flexibility and stiffness can be given to the finger 4, and thus the work of fabricating a semiconductor device is facilitated. |
