| 摘要 |
PURPOSE:To facilitate the detachment of a semiconductor apparatus to be measured, by providing a thin metal film having elasticity to the external lead insert part of the jig for measuring the characteristics of the semiconductor apparatus. CONSTITUTION:At the time of the detachment of a semiconductor apparatus after the measurement of the characteristics thereof, when the B-point of an elastic metal plate 5 is pushed to an A-direction, the metal plate is warped to the side of a semiconductor apparatus in a bow shape and the apparatus 6 is levitated from a measuring jig main body 1. When the force pushing the B-point is released, the metal plate 5 is returned to the original horizontal state by elasticity but, because the apparatus 6 holds the state levitated from the jig 1, detachment work becomes easy.
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