| 摘要 |
PURPOSE:To reduce total cost of a product by electrically connecting a laser diode chip to an external lead through a sub-electrode formed via an insulation layer to the surface where a laser diode chip of sub-mount is fixed. CONSTITUTION:A laser diode chip 5 is electrically connected to an external lead 6a through a sub-electrode 43 formed via an insulation layer 41 of sub- mount 4. Each measuring device is connected to a lower electrode of submount 4 and a sub-electrode 43 for measuring various characteristics of laser diode chip 5 and aging in order to judge adequacy of chip. However, a measured value obtained in this case is a little different from a measured value obtained after packaging, but since heat radiation characteristic becomes better after the packaging. Therefore, the value obtained does not become worth than that measured under this condition. Thereby, since an additional worth to a defective one to be wasted is remarkably reduced, total cost of product can be lowered.
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