Packages for electronic circuits

摘要

A package for mounting an electronic circuit comprises a generally planar insulating substrate (18) having a conductive planar bonding area (20) disposed centrally on its upper surface. A plurality of lead-through conductors (22) are disposed on said upper surface of the substrate to enable electrical connection to be made from the circuit to further external circuitry. The underside of the substrate is metallised to form an earth plane (26). A low impedance path is provided between the bonding area (20) and the conductive earth plane (26) by means of conductive vias (28) which extend through the thickness of the substrate, in some cases by way of intermediate conductive planes (30). Inter-lead cross-talk is reduced by earthed, coplanar fingers (24) disposed between each adjacent pair of lead-through conductors.