| 摘要 |
PURPOSE:To make it possible to shorten a reliability testing time and to enable the detection of a fine flaw, by applying two kinds of liquid penetration treatment and liquid evaporation treatment to a mold element prior to conducting the reliability test of said mold element. CONSTITUTION:A mold element 1 is immersed in molten solder 13 for a predetermined time and the liquid penetrated in the surface of a chip by this treatment is exposed to high temp. of b.p. or more to be instantaneously evaporated At this time, said element 1 generates abrupt volumetric expansion but, because the surface of the chip is molded from a resin material, said volumetric change can not be escaped to the outside and said liquid comes to high pressure gas to collectively apply evaporation pressure to the flow area, especially, a pinhole or minute crack area of the protective film on the surface of the chip and said flaw area is enlarged or destructed. At the same time, an impurity ion is thrown into the flaw under high pressure. When thus pretreated mold element 1 is adapted to a reliability test, the promotion or destruction of the pretreated flaw part or the generation of trouble due to the impurity ion thrown into the flaw part consciously becomes fast and the shortening of a test time or the discovery of fine trouble is enabled.
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