发明名称 SEMICONDUCTOR DEVICE PACKAGE FOR HIGH FREQUENCIES
摘要 A package, for a high-frequency, e.g. microwave, semiconductor device or circuit, having electrical terminal means (12) suitable for cascade connection, comprising a metallic container (40) for containing the semi-conductor device or circuit and a unitary electrical terminal means (12) having a plurality of strip lines (16) formed thereon. The electrical terminal means (12) is composed of an insulating material base (14) on which the strip lines (10) are formed in parallel relationship and a plurality of insulating material block members (15) disposed on the insulating material base (14) so as to cover middle portions of corresponding ones of the strip lines (16). The insulating material base (14) and block members (16) are sintered to form a unified body. The electrical terminal means (12) thus obtained is engaged in a through-hole (21) formed in the side wall portion (40A) of the metallic container so that the strip lines (15) penetrate perpendicularly the side wall portion (40A), and then hermetically sealed to the container.
申请公布号 EP0177943(A3) 申请公布日期 1986.09.17
申请号 EP19850112768 申请日期 1985.10.08
申请人 FUJITSU LIMITED 发明人 YAMAMURA, SHIGEYUKI C/O FUJITSU LIMITED
分类号 H01L23/12;H01L23/047;H01L23/66 主分类号 H01L23/12
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