| 摘要 |
PURPOSE:To avoid discharge between guides and other conductive parts and prevent a chip inside a package from damage by a method wherein the guides are covered with insulative resin except positioning pin holes and a groove is provided near a machine screw hole. CONSTITUTION:Guides 12, provided at both ends of headers 11 for defining the molding height of the headers 11 at the time of resin molding, are covered with resin except positioning pin holes 5. A groove 4 is provided near a machine screw hole 3. With this constitution, discharge between the guides 12 and other conductive parts is avoided. Also, a brittle chip 13 packed inside a resin package 1 is prevented from damage caused by a tightening torque of a screw at the time of mounting. |
