| 发明名称 |
Integrated circuit package |
| 摘要 |
An integrated circuit package cover includes a groove with a quadrangular cross-section which contains a self-supporting sealant material of similar cross-section. During assembly, the sealant material is penetrated by the lead-ins and flows around them to achieve an environmental seal for the packaged chip.
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| 申请公布号 |
US4611398(A) |
申请公布日期 |
1986.09.16 |
| 申请号 |
US19840659212 |
申请日期 |
1984.10.09 |
| 申请人 |
GTE PRODUCTS CORPORATION |
发明人 |
EAMES, ROBERT J.;JOHNSON, RICHARD E. |
| 分类号 |
H01L23/02;H01L23/04;H01L23/10;(IPC1-7):H05K3/30;H05K1/18 |
主分类号 |
H01L23/02 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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