发明名称 Resinous composition
摘要 A resinous composition, having excellent toughness, flexibility, heat resistance and moldability, comprises (A) from 5 to 98% by weight of a polyamide and (B) from 95 to 2% by weight of a polyolefin modified with from 0.001 to 10% by mole based on all polymer components of a component having at least one functional group selected from the groups represented by the following general formulas (I), (II) and (III); <IMAGE> (I) <IMAGE> (II) <IMAGE> (III) wherein R1 denotes an organic group and R2, R3, R4 and R5 denote a group selected from the groups consisting of hydrogen atom and organic group respectively.
申请公布号 US4612346(A) 申请公布日期 1986.09.16
申请号 US19840620148 申请日期 1984.06.13
申请人 TORAY INDUSTRIES, INC. 发明人 CHIBA, KAZUMASA;TANAKA, KIYOJI
分类号 C08L51/04;C08L77/00;(IPC1-7):C08L77/00 主分类号 C08L51/04
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