| 摘要 |
PURPOSE:To prevent the oxidation of pads by a method wherein, after carbon ink is coated at least on one surface of the external circuit connecting pad of a semiconductor pellet and a pellet connecting terminal, each pad is adhered to the surface of a substrate in such a manner that each pad is opposed to each terminal located on the surface of a wiring substrate. CONSTITUTION:Carbon ink 20 is coated on the upper surface of a flat plate 40 in uniform thickness, and the carbon ink 20 is adhered to each protruded part 41a by pressing the protrusion arranged member 41 whereon a number of protruded parts 41a which are a little wider than the pads 11 of a semiconductor pellet 10 are projectingly provided leaving a space corresponding to each pad 11 of an LSI pellet 10. Then, the member 41 is pulled up, each protruded part 41a is opposed to each pad 11 of the pellet 10 and pressed against the pellet 10, and after the carbon ink 20 which is adhered to each protruded part 51a is coated on the surface of each pad 11, the letterpress member 41 is pulled up, and the carbon ink 20 coated on the surface of each pad 11 is dried up. As a result, the oxidation of the pad can be prevented. |
