发明名称 |
Bond wire transmission line. |
摘要 |
A bond wire connection between two semiconductor devices alleviates the problem of inductive loading at high frequencies by providing a capacitive effect which compensates for inductive reactance. The capacitive effect is provided by utilizing multiple parallel layers of bond wires at a common electrical connection point. As more layers are added the net impedance can be controlled so as to match the impedance driving the downstream semiconductor. |
申请公布号 |
EP0194133(A2) |
申请公布日期 |
1986.09.10 |
申请号 |
EP19860301528 |
申请日期 |
1986.03.04 |
申请人 |
TEKTRONIX, INC. |
发明人 |
GRELLMAN, ERWIN H.;ROLAND, LEONARD A. |
分类号 |
H03H7/38;H01L23/50;H01L23/66;H01L25/04;H01L25/16;H01L25/18;H01L27/13;H01P3/08;H01P5/02;H01P5/08 |
主分类号 |
H03H7/38 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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