发明名称 RESIN COMPOSITION FOR SEALING ELECTRONIC PART
摘要 PURPOSE:The titled composition having improved adhesivity to metals, heat resistance and insulating properties, comprising a specific unsaturated alicyclic epoxy ester compound, a polymerizable vinyl monomer, a photopolymerization initiator, a carboxyl end group-containing butadiene polymer, etc. as essential components. CONSTITUTION:(A) An unsaturated alicyclic epoxy ester compound (e.g., compound shown by the formula, etc.) obtained by reacting 1 equivalent epoxy group of an alicyclic epoxy compound containing >=two or more epoxy groups in one molecule with 0.5-1.1 equivalent (meth)acrylic acid is blended with (B) a polymerizable vinyl monomer (e.g., methyl acrylate, etc.), (C) 0.1-10wt% based on the components A+B of a photopolymerization initiator (e.g., benzoinbenzoin methyl ether, etc.), and (D) 0.1-2wt% based on the components A+B of a carboxyl end group-containing butadiene polymer or a butaene/ acrylonitrile copolymer as essential components in a weight ratio of the component A/B of preferably 50/50-90/10, to give the aimed composition.
申请公布号 JPS61204216(A) 申请公布日期 1986.09.10
申请号 JP19850045220 申请日期 1985.03.07
申请人 DAICEL CHEM IND LTD 发明人 FUNATO SUSUMU;WATANABE MASAHARU;MURAI TAKAAKI
分类号 C08F299/00;C08F2/48;C08F290/00;C08F299/02;H01L23/29;H01L23/31 主分类号 C08F299/00
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