发明名称 EPOXY RESIN COMPOSITION FOR SEALING SEMICONDUCTOR
摘要 PURPOSE:The titled composition having low stress and improved water-vapor resistance, comprising a novolak type epoxy resin, an orthonovolak type phenolic resin, an inorganic fillr, a curing promoter, and a titanate coupling agent as essential components. CONSTITUTION:(A) A novolak type epoxy resin is blended with (B) an orthonovolak type phenolic resin, (C) an inorganic filler, (D) a curing promoter, and (E) a titanate coupling agent, to give the aimed composition. The amount of the component E added is preferably 0.5-2.5wt% based on the composition.
申请公布号 JPS61204220(A) 申请公布日期 1986.09.10
申请号 JP19850045810 申请日期 1985.03.08
申请人 FUJITSU LTD 发明人 NISHII KOTA;YONEDA YASUHIRO;MIYAGAWA MASASHI;FUKUYAMA SHUNICHI;MATSUURA AZUMA
分类号 C08G59/00;C08G59/20;C08G59/32;C08G59/62;C08K5/56;C08L63/00;H01L23/29;H01L23/31 主分类号 C08G59/00
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