| 摘要 |
<p>A curable resin composition comprising, (a) at least one of partially acrylated and methacrylated epoxy resins; (b) a sensitizer which can initiate at least one of acryloyl group or methacryloyl group by photoirradiation; and (c) a curing catalyst comprising an organic metal compound' and an organic silicon compound. The curable resin composition of this invention can be cured by photoirradiation and heating, and the cured product obtained has excellent electrical characteristics, adhesiveness, humidity resistance and solder heat resistance, and therefore it can be expected to be useful for electrical insulating materials, paints, materials for solder resist, etc.</p> |
