| 摘要 |
PURPOSE:The titled composition free from settlement of an inorganic filler and being excellent in long-term stability, containing an inorganic filler treated with a specified organic phosphate. CONSTITUTION:An inorganic filler for epoxy resin is obtained by adding 0.01-20 pts.wt. organic phosphate of formula I [wherein R is a 4-24C alkyl, an aryl having at least one 1-24C alkyl substituent, formula II (wherein R4 is H or CH3), R<1> is a 2-4C alkylene, n is 1-50 and R<2-3> are each alkyl, aryl of formula III] to 100pts.wt. inorganic filler (e.g., alumina), thoroughly agitating the mixture and heating it to 50-150 deg.C. An epoxy resin is mixed with said inorganic filler and, optionally, a curing agent, cure accelerator, pigment, flame retardant, mold release, etc.
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