| 摘要 |
<p>PURPOSE:To reduce amount of bonding agent to be cut by the blade, alleviate load on the blade and remarkably extend the operation life of blade by cutting the semiconductor wafer from the front surface to the rear surface after attaching a semiconductor wafer onto a sheet where bonding agent is dotted in the form of projected islands. CONSTITUTION:Many projections 12 of bonding agent are dotted on a sheet 11 and the rear surface of semiconductor wafer 13 is attached thereon. The sheet 11 is attached to a fixing frame 14, fixed thereto, set to a dicing apparatus and a cutting groove 15 is provided to the rear surface from the front surface of the semiconductor wafer. The dotting the projections 12 of bonding agent may be formed at random or with constant interval and in the constant position.</p> |
