发明名称 CERAMIC MODULE
摘要 PURPOSE:To improve mounting efficiency in a module and the mounting efficiency of a printed wiring board by forming a connecting terminal leading out signals even to a section different from a signal leading-out terminal section. CONSTITUTION:Connecting terminals 14, 16 are fitted to sections, to which signal leading-out terminals 3 are mounted, in a ceramic module, and both ceramic modules are connected by conductors such as flat cables on surfaces except surfaces, to which the signal leading-out terminals 3 are fitted, in two ceramic modules. Consequently, electronic parts, which cannot be loaded due to the shortage of the number of the signal leading-out terminals, are incorporated, thus obtaining the ceramic module having high mounting density. The ceramic module and another ceramic module need not be signal-connected on the printed wiring board side to which the ceramic modules are set up. Accordingly, the mounting efficiency of the printed wiring board side can be enhanced.
申请公布号 JPS61201453(A) 申请公布日期 1986.09.06
申请号 JP19850041061 申请日期 1985.03.04
申请人 MITSUBISHI ELECTRIC CORP 发明人 KUMAGAI MASAHIKO
分类号 H05K1/18;H01L23/50;H05K1/03;H05K1/14;H05K3/36;H05K3/40 主分类号 H05K1/18
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