| 摘要 |
<p>A method is provided for making integrated circuit silicon composite die having a hot melt adhesive on the surface of its silicon base. An integrated circuit silicon wafer silicon composite die in wafer form is diced after a hot melt adhesive has been applied onto its silicon base utilizing a spin coating procedure. Integrated circuit silicon composite arrays are also provided by integrally bonding the integrated circuit silicon die onto a carrier substrate.</p> |
