发明名称 COATING COMPOSITIONS AND RESIN MOLDINGS USING SAME
摘要 Coating compositions comprising 100 parts by weight of a mixture composed of 50-98% by weight of at least one multifunctional monomer selected from compounds having 3 or more acryloyloxy groups and/or methacryloxy groups in 1 molecule, and 2-50% by weight of a bifunctional oligomer represented by the following general formula <IMAGE> <IMAGE> +TR <IMAGE> wherein R1 represents hydrogen or methyl, and n is an integer of 1 through 5, 0.01-10 parts by weight and polymerization inhibitor 10 through 2,000 ppm of a polymerization inhibitor, and being capable of forming a bridge hardened film of superior abrasion resistance, etc. by the application of activation energy rays, and resin moldings using the coating compositions.
申请公布号 DE3175017(D1) 申请公布日期 1986.09.04
申请号 DE19813175017 申请日期 1981.03.24
申请人 MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. 发明人 INOUE, TAKAO;WAKAHATA, TAMOTSU;MAEDA, YUKIO;NIBOSHI, IKUO
分类号 C08F2/00;B32B27/00;B32B27/16;B32B27/30;C08F2/46;C08F2/48;C08F2/50;C08F299/02;C08J7/04;C09D4/00;C09D4/06;C09D163/10;(IPC1-7):C09D3/80;C08F220/20 主分类号 C08F2/00
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