发明名称 WIRE BONDING DEVICE
摘要 PURPOSE:To obtain the device with which a loop-shaped wire bonding can be performed in a stabilized manner by a method wherein a vacuum column, with which tension is given, is provided between a wire reel and a bonding tool. CONSTITUTION:The wire 14 wound on a wire reel 13 is retained in the state as shown in the diagram through the intermediaries of a vacuum column 30, a clamper 18 and a bonding tool 19. When vacuum pressure is applied in the direction as shown by the arrow 23 from between spacers 16a and 16b under the above-mentioned state, the wire 14 is pressed to the side face of the spacers 16a and 16b by atmospheric pressure 22. As tension is given to the wire 14 by the vacuum column 30 as above-mentioned, no damage is generated on the wire 14. Also, even when sag is generated on the wire 14 when a bonding work is performed, the wire 14 can be wound back into the column 30. Besides, the tension on the wire 14 can be controlled by adjusting the interval A between the spacers 16a and 16b without adjusting the degree of vacuum.
申请公布号 JPS61199644(A) 申请公布日期 1986.09.04
申请号 JP19850040417 申请日期 1985.03.01
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 INAGAKI NORIYUKI;MAKINO YUTAKA;YAMAMOTO AKIHIRO;YOSHIDA TAKEICHI
分类号 H01L21/60 主分类号 H01L21/60
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