发明名称 CONNECTION METHOD FOR CONDUCTOR AND BACKING MATERIAL FOR CONNECTION
摘要 PURPOSE:To perform the connection of high productivity and high reliability by interposing the conductor for joining between the conductors to be connected having insulating films, by destroying the insulating film with heating the conductor to be connected and by joining the exposed face of the conductor to be connected with melting the conductor for joining. CONSTITUTION:In case of connecting a coil 5 to a riser 8 the one part of the riser 8 is folded back so that the conductor layer 3 for joining becomes at the inner side and the coil 5 can be hanged on this folded part 9 without peeling a insulating film 6. In succession electrode 10 is press-connected like crushing the folded part 9 and electrified for short time. A low temp. A low temp. molten layer 4, conductor layer 3 for joining and coil 5 are heated via the riser 8 by heat-input and the surface of copper wire 6 is exposed with the insulating film 7 of coil 5 being burned up. When the heating temp. reaches the set temp. the conductor layer 3 for joining is melted, joining effectively and properly on the exposed surface of the copper wire 6.
申请公布号 JPS61199575(A) 申请公布日期 1986.09.04
申请号 JP19850041721 申请日期 1985.03.01
申请人 MITSUBA DENKI SEISAKUSHO:KK 发明人 HOSHINO MASATOSHI
分类号 H01R43/02;B23K1/00;H01R4/02 主分类号 H01R43/02
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