| 摘要 |
<p>A solderless connector effects connection between a multi-layer flexible circuit and a rigid electronic circuit. A first embodiment (Figure 1) is characterized by (a) wrapping separated layers of a two or more layer flexible circuit (12) about an elastomeric resilient member (30) such that the terminal ends of each layer are provided on one side of the resilient member and (b) clamping the combination onto a rigid circuit board (14). In a second embodiment (Figure 7A), a multi-layer flexible circuit (48) is provided with successive steps formed in each layer wherein the terminating portions of each circuit layer have a progressively longer length. This stepped multi-layer flexible circuit (48) is then clamped to a rigid circuit (118) by stepped rigid retainer plate (76), wherein a resilient elastomeric member (116) is positioned between the stepped flexible circuit (48) and the steps of the rigid retainer plate (76) such that uniform pressure is maintained on all layers during interconnection with another electronic circuit device (118). Resilient material may be associated with individual laminae of the stepped flexible circuit (Figure 7B, not shown). <IMAGE></p> |
