| 摘要 |
PURPOSE:To enable to perform the armoring of a hybrid integrated circuit easily and completely by a method, before parts are mounted on the part- mounting surface of the substrate of the hybrid integrated circuit, the mounting parts are mounted after a picture-frame shaped dam is formed and hardened on the circumference of the substrate, and synthetic resin is poured into said dam. CONSTITUTION:The prescribed pattern 2 is formed on a DIP type circuit substrate 1, and a picture-frame shaped dam 5, consisting of synthetic resin such as polyimide and the like, for example, is molded and hardened along the circumference of the part-mounting surface of the circuit substrate 1 under the condition wherein a number of lead terminals 4 are provided. Then, after the prescribed mounting part 5 is mounted on the substrate 1, liquid synthetic resin such as polyimide and the like is poured into the formed and hardened dam 5, and a resin coating is formed by natural-hardening the liquid synthetic resin to the degree that is does not flow out from the dam 5. |
