| 摘要 |
PURPOSE:To simplify the manufacturing process of the title device, by a method wherein an insulative light-shielding layer is directly formed on the transparent substrate and an electrode layer, a photoelectric conversion layer and a transparent protective layer are laminated thereon. CONSTITUTION:Photo absorbing powder is mixed into polyimide varnish, and after that, the solvent is dripped on a transparent substrate 20 and the transparent substrate 20 is made to revolve by a spinner. After that, the solvent is dried and an insulative light-shielding layer 21 is formed by making the dried matter heat-cure. After light- transmitting layers are formed on this insulative light-shielding layer 21, such a metal as Cr is evaporated, a patterning is performed in a comb teeth-shape and opposed electrodes 23 and 24 are formed. Here, the opposed electrodes 23 become a common electrode side and the opposed electrodes 24 become an individual electrode side. After a light-transmitting window 24a to correspond to each light-transmitting window 22 is formed on each individual electrode 24, an a-Si layer 25 is formed on the opposed electrodes 23 and 24 in a band shape as the photoelectric conversion layer. By this way, the light-shielding layer and the insulating layer can be simply formed as a single layer, thereby enabling to simplify the manufacturing process of the tightly adhered photoelectric conversion device and to manufacture the device into a low- priced one. |
