发明名称 METHOD FOR DETECTING START OF ELECTROLESS PLATING
摘要 PURPOSE:To detect correctly the start of electroless plating by immersing a material to be plated in an electroless plating soln. immediately after supplying electric current between an anode and a cathode in the plating soln., measuring the potential difference between the cathode and the material to be plated and confirming the reduction of the potential difference to zero. CONSTITUTION:When a very thin layer of Co-P or the like is formed by electroless plating in a short time, it is required to confirm the start of electroless plating. A bar anode 3 and a bar cathode 4 are put in an electroless plating soln. 2 in a plating tank 1. Immediately before a material 7 to be plated is immersed in the plating soln. 2, electric current is supplied between the anode 3 and the cathode 4 from a DC power source 5 to activate the cathode 4 by the deposition of Co-P. The material 7 is then immersed at once in the plating soln. 2. When Co-P is deposited on the material 7, the potential difference between the cathode 4 and the material 7 measured with a potentiometer 6 is reduced to zero. This point of time is considered to be the time when the electroless plating of Co-P on the material 7 starts.
申请公布号 JPS61199070(A) 申请公布日期 1986.09.03
申请号 JP19850039952 申请日期 1985.02.28
申请人 C UYEMURA & CO LTD 发明人 SUGIURA YUTAKA
分类号 C23C18/16;C23C18/31;C23C18/34;C23C18/40;H05K3/18 主分类号 C23C18/16
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