| 摘要 |
PURPOSE:To improve the heat-dissipating characteristic and the insulation characteristic, by interposing an insulating member between a conductive supporting plate and a heat-dissipating fin. CONSTITUTION:A semiconductor element 11, a conductive supporting plate 10, an insulating member 12, and a heat-dissipating fin 13 are integrally resin- sealed with a mold layer 15 so that the part of a conductive strip 14 serving as the outer lead of the supporting plate 10 may be led out and the heat- dissipating surface of the fin 13 may be exposed. The title device 20 thus constructed can improve the heat-dissipating characteristic by reducing the thickness and volume of the mold layer 15 under the supporting plate 10 because of installation of the fin 13 to the back side of the supporting plate 10 via insulating member 12. Besides, because of the interposal of the insulating member 12, the insulation characteristic can be improved at the same time. |
