| 摘要 |
PURPOSE:To realize mounting having high density by forming an Au conductor projecting section for connection corresponding to a semiconductor element pad section onto a conductor in a connecting section for a circuit substrate. CONSTITUTION:Connecting conductors (AgPd alloys, etc.) 2 and Au projecting sections 6 are printed onto a substrate (alumina ceramics, etc.) 1, the thickness of these conductors and projecting sections is controlled, and these conductors and projecting sections are baked and formed. Pads 5a, 5b for a semiconductor element 3 are loaded onto Au projecting sections 6a, 6b on a conductor section for the substrate 1 and heated and contact-bonded, and Au is melted, thus connecting the substrate and the element. According to the constitution, a space between the element and the substrate conductor through a conventional wire connecting method is reduced to a negligible value, thus increasing mounting density. |
