发明名称 |
ASSEMBLY-HEAT SINK FOR SEMICONDUCTOR DEVICES |
摘要 |
The present invention is directed to an assembly-heat sink for semiconductor fusions. The fusions are disposed within the assembly-heat sink between cylindrical metal members which both cool the fusions and facilitate making electrical contact to the fusions. Top and bottom members of the assembly-heat sink, which entirely enclose the cylindrical members and the fusions are comprised entirely of metal permitting the assembly-heat sink to be cooled from three sides. The fusions are electrically insulated from the top and bottom members of the assembly-heat sink. |
申请公布号 |
GB2129215(B) |
申请公布日期 |
1986.09.03 |
申请号 |
GB19830026923 |
申请日期 |
1983.10.07 |
申请人 |
* WESTINGHOUSE ELECTRIC CORPORATION |
发明人 |
KENNETH GERARD * LONGENECKER;THOMAS BOYD * GEARY |
分类号 |
H01L23/36;H01L23/40;(IPC1-7):H01L25/08 |
主分类号 |
H01L23/36 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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