| 摘要 |
PURPOSE:To obtain an electroforming die having a complex uneven part in a short period by electrodepositing a thin layer on the surface of a matrix having an uneven part, filling amalgam into the recesses, and forming an electrodeposited layer on the surface of the amalgam. CONSTITUTION:An electrodeposited thin layer 4 of about 0.2-1mm thickness is formed on the surface of a matrix 1 for an electroforming die such as a toothed matrix having plural projections 2 and recesses 3 on the surface. Amal gam 5 is filled into the recesses 3 with the layer 4 in-between to make the surface of the matrix 1 nearly even. Sn, Cu, Zn or an alloy thereof is used as the base of the amalgam 5. The amalgam 5 is then hardened, and at this time, the surface of the amalgam is activated. A plated layer 6 of about 0.01-0.1mm thickness is formed on the activated surface and an electrodeposited layer 7 is formed on the layer 6 in a plating bath through which a high electric current can be passed, such as nickel sulfamate bath.
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