| 摘要 |
PURPOSE:To conduct positioning with high precision by a method wherein a part image is memorized, an optical part is turned at 180 deg. centering around an optical axis, a real image is displayed to a device and a memorized picture is read and superposed to the real image and positioned. CONSTITUTION:An optical device 20 is inserted between a chip 1 and a wiring substrate 3 by an XY base 9, a lens-barrel 8 is turned, a solder bump 2 on the chip 1 is lightened by a luminaire 12 and a half mirror 13 by a mirror 10 and magnified by an optical system 11, and a real picture detected 14 is displayed to a CRT 16 and memorized 15. The lens-barrel 8 is turned at 180 deg. and the solder bump 2 is displayed to the CRT 16 by a mirror 10', the black and white of a memorized picture are inverted and read on the same picture surface and a position thereof is adjusted 5, and both pictures are overlapped and picture signals are extinguished. The lens-barrel 8 is rotated at 180 deg. again, and the same operation is conducted regarding solder bumps on diagonal lines. The optical device 20 is retreated, a collet 17 is brought near to the base 5, suction is released, the chip 1 is positioned onto the wiring substrate 3, and the collet is moved backward, thus completing a positioning process. According to the constitution, positioning is enabled with high accuracy of + or -1mum. |
