发明名称 Apparatus for soldering printed circuit panels
摘要 Apparatus for soldering printed circuit panels includes a roll configuration to convey the panels horizontally across a container carrying molten solder. The printed circuit panels are immersed in molten solder when they pass through the roll configuration. At least one air knife located at the output side of the roll configuration serves to level the molten solder on the panels as they exit from the rolls.
申请公布号 US4608941(A) 申请公布日期 1986.09.02
申请号 US19850690140 申请日期 1985.01.10
申请人 TELEDYNE ELECTRO-MECHANISMS 发明人 MORRIS, GILBERT V.
分类号 B23K1/08;B23K3/06;H05K3/34;(IPC1-7):H05K3/22 主分类号 B23K1/08
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