Process of heat treating copper film on ceramic body and heat treating apparatus therefor

摘要

A process for metallizing a copper film comprising the step of heat treating a copper film formed by an electroless plating process as opposing electrodes of a ceramic capacitor. The process comprises the steps of placing a ceramic body having a copper film formed on the surface thereof by an electroless plating process within a container sealing the same from the external atmosphere and maintaining constant the internal atmosphere, and heating the container maintaining the surrounding of the container in an inert atmosphere.